This Week in AI:
🔵 Qualcomm High Bandwidth Compute (HBC) silicon, the foundation for Qualcomm Dragonfly AI250 and next-generation data center AI inference, is now validated on real hardware: bit.ly/47ZgOQj
🔵 Vinesh Sukumar, VP, AI/ML Product Management at Qualcomm, joined @worthmag's Techonomy 26: Intelligence at Scale to discuss how AI is evolving across wearables and edge devices while balancing performance, power, and form factor: bit.ly/3UnuiCe
🔵 Qualcomm EVP & CMO @donnymac joined the @voguemagazine Business Global Summit to share his perspective on the evolving relationship between Personal AI, technology, and fashion: bit.ly/4iC382n
🔵 Qualcomm High Bandwidth Compute (HBC) silicon, the foundation for Qualcomm Dragonfly AI250 and next-generation data center AI inference, is now validated on real hardware: bit.ly/47ZgOQj
🔵 Vinesh Sukumar, VP, AI/ML Product Management at Qualcomm, joined @worthmag's Techonomy 26: Intelligence at Scale to discuss how AI is evolving across wearables and edge devices while balancing performance, power, and form factor: bit.ly/3UnuiCe
🔵 Qualcomm EVP & CMO @donnymac joined the @voguemagazine Business Global Summit to share his perspective on the evolving relationship between Personal AI, technology, and fashion: bit.ly/4iC382n