PIXAPP is an EU funded project. PIXAPP is the world’s first open-access Photonic Integrated Circuit Assembly and Packaging Pilot Line. @photonics21@photonicsEU
Tyndall National Institute pixapp.eu
Joined June 2017
Peter O'Brien presenting at the Pilot Lines workshop organised by @pic_conference. If you want to know more about our #photonics#packaging solutions visit pixapp.eu
PIXAPP will be exhibiting at @pic_conference on 9-10 November 2021, in Brussels, Belgium. Visit us to know more about our offer of Standard Solutions for PIC Packaging. More at 👉 pixapp.eu/2021/09/27/pix…
Peter O'Brien, will present at the OTM on Automated #Packaging & Testing of #Photonic Integrated Circuits on 4 October. Join us to learn about PIXAPP’s Packaging Solutions based on Scalable and Validated Process Building Blocks. pixapp.eu/2021/09/27/pix…
The development of systems for #AR visualization brings a number of #photonic challenges to the table. Join us on 27 September to identify the role of PICs in these systems and which are the processes for #packaging & #assembly involved.