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A pickpocket recorded by youtuber in Japan.
youtube.com/watch?v=mqztXF…

This is the example from ASML to see the world-wide cooperation for the most advanced scanner. If someone restrict components from solo supplier in supplier chain, then there will be no integration and no tool can be delivered.

TSM Cross-node Chip Die Size Shrinks and Total Power Consumption Comparison.
From TSM 2022 Sustainability Report lnkd.in/gPuteFrz

Overlay performance of Chip-on-Wafer bonding status and challenges from tsmc published in 2023 VLSI Symposium. It is interesting to see CSAM is implemented as bonding yield index. lnkd.in/gKPQynrR

Defect Density trend chart for 10/7/5nm of Qualcomm's products in Samsung Foundry. It looks good.
From Qualcomm's paper in IEDM 2022 lnkd.in/gaib239H